2. Self-Centering of Offset Chip Components in a Pb-free Assembly”, Amey Teredesai, Srinivasa Aravamudhan and Joe Belmonte, Richard Szymanowski, To be presented at IPC 2004.


3. “HUPUG’s Lead-free design, materials and process of high density packages”, Joe Smetana, BobHorsley, John Lau, Ken Snowdon, Dongkai Shangguan, Jerry Gleason, IRV Memis, Dave Love, Walter Dauksher and Bob Sullivan, presented at IPC 2003.

4. “Process characterization of pcb assembly using 0201 packages with lead-free solder, David Geiger, Fredrik Mattsson”, Dr. Dongkai Shangguan, MT Ong, Patrick Wong, Mei Wang, Todd Castello, and Sammy Yi, NEPCON West - Fiberoptic Expo, 2002

 

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